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MS Final Examination – McKay Lindsay


Thursday, September 14, 2017 1:00 PM - 3:00 PM

Co-planar Integration of Silicon Integrated Circuits and Microfluidic Networks for Biosensor Applications
Silicon integrated circuit (IC) technology has enabled numerous electrical and optical sensors used in biological and chemical assays, where they can increase performance while decreasing cost and size compared to traditional detectors. There is significant potential to further leverage IC technology for lab-on-chip applications, creating affordable and portable medical diagnostic equipment by integrating sensors directly on the chip surface. This benefit is lost if chip makers must use large chip area to allow fluidic transport of biological or chemical sample to the sensors. In addition, traditional wire bond packaging creates a non-planar surface that is incompatible with traditional planar microfluidic structures. In this work, we use an industrial compression molding technique to embed CMOS integrated circuit dice in a planar epoxy substrate, which allows for the use of standard photolithographic processes for metallization, as well as the incorporation of planar microfluidic delivery. We demonstrate combined fluidic and electrical routing over CMOS-integrated optical sensors in an accurate and reproducible way, as well as demonstrate an optical transmission experiment in the complete sensor platform. This scalable technique will enable a broad range of future IC-based biosensors and multi-sensor lab-on-chip systems.

Major Advisor: Matthew Johnston
Committee: Donald Heer
Committee: Larry Cheng
GCR: Yigit Menguc


Kelley Engineering Center (campus map)
1007
Calvin Hughes
1 541 737 3168
Calvin.Hughes at oregonstate.edu
Sch Elect Engr/Comp Sci
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